Model: tin content is 63%, the lead content is 37%
In the brazing temperature under 300'C, liquid solder surface such as mirror bright;Slag quantity only about 1/7 of the ordinary solder;Have wetting time is short, expansion rate is better than that of general solder;Because of the addition of antioxidant make bright spot, beautiful and reliable.Apply to electronic product wave soldering and hot dip soldering.(wave soldering cylinder temperature: 250 + 5'C; hot dip soldering tin cylinder temperature: 260 + 5'C
Article tin industry advanced technology & equipment production, effective control of various composition proportion, driving the organic combination between components, reduce the tin slag production line, improve brightness, tin tin flow, wettability. Suitable for all kinds of wave crest or manual welding.